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High Thermal Conductive Two Component Potting Silicone Adhesive For Electronic Industry Heat Dissipation

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High Thermal Conductive Two Component Potting Silicone Adhesive For Electronic Industry Heat Dissipation

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Brand Name : ziitek

Model Number : TIG680-40AB

Certification : RoHs

Place of Origin : China

MOQ : 25PC

Supply Ability : 1000PC/Day

Delivery Time : 2-3 work days

Packaging Details : 300ml/1PC

Products name : High Thermal Conductive Two Component Potting Silicone Adhesive For Electronic Industry Heat Dissipation

Application : Electronic Industry Heat Dissipation

Thermal Conductivity : 4.0W/(m·K)

Density(g/cm³) : 3.15

Operation temperature : -45~200℃

Hardness(Shore A) : 25

Appearance : Gray

Keywords : Thermal conducting potting compound

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One Component Dealcoholized Room Temperature cured Thermally Conductive Silicone Adhesive

TIG®680-40AB Series is a two-component high thermal conductivity silicone sealant with room temperature curing, long working time, and flame retardant properties. This product is particularly suitable for sealing capacitors and small electronic devices. Its excellent flexibility properties enable it to provide excellent cushioning protection for coating materials. The low viscosity characteristic enables the thermal conductive sealant to cover the surface more comprehensively, greatly improving the heat transfer efficiency of the heating element or the entire printed circuit board to the metal shell or heat dissipation plate,thereby improving the performance and service life of electronic components.

Feature


> Good thermal conductivity: 2.0W/mK
> Good insulation performance
> Good elasticity
> Lower shrinkage
> Low viscosity,easy gas emissions
> Good solvent resistance and waterproof performance
> Longer working hours
> Excellent high and low temperature resistance
> No odor release during the curing process

Application
> Industrial control,transfomer,coil, amplifier, high voltage package,relay, high current junction box,etc
> Heat sink assembly, thermal sensor potting,thermal conductive product potting
> Heat conduction between the battery cell and the cold tube
> LED and power drive potting
Typical Properties of TIG®680-40AB Series
Material Properties (Before Curing)
Property Numerical Test Method
Color/Part A White Visual
Color/Part B Gray Visual
Part A Viscosity (mPa.s) 16000 GB/T 10247
Part B Viscosity (mPa.s) 23000 GB/T 10247
Mix Ratio 1:1 Ziitek Test Method
Shelf life 6 months(Unopened) Ziitek Test Method
Cure Schedule
Pot Life @25℃ 30~45 mins Ziitek Test Method
Cure @70℃ 20~30 mins Ziitek Test Method
Cure Material Properties
Color Gray Visual
Hardness (Shore A) 25 ASTM D2240
Density (g/cm³) 3.15 ASTM D792
Recommended Operating temperature (℃) -45 ~200 *****
Flame Rating V-0 UL 94
Thermal Conductivity (W/mK) 4.0 ASTM D5470
Breakdown Voltage (V/mm) ≥10000 ASTM D149
Dielectric Constant @1MHz 6.0~8.0 ASTM D150
Volume Resistivity (Ohm·cm) 3.0x1013 ASTM D257

High Thermal Conductive Two Component Potting Silicone Adhesive For Electronic Industry Heat Dissipation

Company Profile

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

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Product Tags:

Thermal conductive potting silicone adhesive

      

Two-component electronic adhesive heat dissipation

      

High thermal conductive silicone for electronics

      
Quality High Thermal Conductive Two Component Potting Silicone Adhesive For Electronic Industry Heat Dissipation for sale

High Thermal Conductive Two Component Potting Silicone Adhesive For Electronic Industry Heat Dissipation Images

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