TIS™580-10 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective. TIS™580-10 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use. TIS™580-10 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.
Feature
> Good thermal conductivity: 1.0W/mK
> Good maneuverability and good adhesion
> Low shrinkage
> Low viscosity, leads to void-free surface
> Good solvent resistance, water resistance
> Longer working life
> Excellent thermal shock resistance
Application
It mainly used in substituting thermally-conductive paste and pads, which currently finds in gap-filling adhesives or heat conduction between LED aluminium motherboard and heat sink, high power electrical module and heat sink. Traditional methods such as fins and screws fixing can be replaced by applying TIS580-13, resulting a more reliable gap-filling thermal conduction, simplified handling and more cost-effective.
E.g. Massive application in integrated circuits in portable computer, microprocessor, high power LED, internal storage module, cache, integrated circuits, DC/AC translator, IGBT and other power modules, encapsulation of semi-conductors, relay switches, rectifiers and transfomers
| Semiconductor cases and heat sinks |
| Power resistors and chassis, thermostats and mating surfaces, and thermoelectric cooling devices |
| CPUs and GPUs |
| Automatic dispensing and screen-printing |
| Mobile, desktop |
| Engine and transmission control modules |
| Memory modules |
| Power conversion equipment |
| Power supplies and UPS |
| Power semiconductors |
| Custom ASICS Chips |
| Integrated Gate Bipolar Transistors (IGBT) |
| Between any heat generating semiconductor and heat sink |
| Custom power modules |
| Telecommunications and automotive electronics |
| LED Power Supply |
| LED Controller |
| LED Lights |
| LED Ceilinglamp |
| Typical values of TISTM580-10 |
| Appearance | White paste | Test Method |
| Density(g/cm3,25℃) | 1.3 | ASTM D297 |
| Tack-free time(min,25℃) | ≤20 | ***** |
| Cure type(1-component) | Dealcoholized | ***** |
| Viscosity@25℃ Brookfield (Uncured) | 20K cps | ASTM D1084 |
| Total cure time(d, 25℃) | 3-7 | ***** |
| Elongation(%) | ≥150 | ASTM D412 |
| Hardness(Shore A) | 25 | ASTM D2240 |
| Lap Shear Strength(MPa) | ≥2.0 | ASTM D1876 |
| Peel Strength(N/mm) | ＞3.5 | ASTM D1876 |
| Operation temperature(℃) | -60～250 | ***** |
| Volume Resistivity(Ω·cm) | 2.0×1016 | ASTM D257 |
| Dielectric Strength(KV/mm) | 21 | ASTM D149 |
| Dielectric Constant (1.2MHz) | 2.9 | ASTM D150 |
| Thermal Conductivity W/(m·K) | 1.0 | ASTM D5470 |
| Flame Retardancy | UL94 V-0 | E331100 |
